On May 15th, banking institutions continued to issue technology innovation bonds (hereinafter referred to as “Sci Tech Innovation Bonds”) in large quantities, and bond funds are rapidly flowing into technology innovation enterprises. On May 16th, Shanghai Bank will soon issue the first batch of science and technology innovation bonds for 2025, with an issuance scale of 5 billion yuan. According to publicly available information on China Money Network, as of May 14th, 9 banks have issued announcements related to the issuance of the first phase of science and technology innovation bonds in 2025. Among them, 8 banks have completed their issuance, namely China Development Bank, Industrial and Commercial Bank of China, Agricultural Bank of China, Bank of Communications, Industrial and Commercial Bank of China, Shanghai Pudong Development Bank, Hangzhou Bank, and Bohai Bank. The total issuance scale of the above-mentioned 9 banks’ sci-tech innovation bonds will reach 120 billion yuan. Multiple banks have stated that the raised funds will be precisely directed towards the field of technological innovation, providing financial support for the growth and expansion of technology innovation enterprises.
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